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  • Tungsten-titianium Target
  • Tungsten-titianium Target

Tungsten-titianium Target

As a special electronic material with high added values, semiconductor targets are mainly used in microelectronics, display, memory, optical coating and other industries to sputter various thin film materials for cutting-edge technology.

Product Description


產(chǎn)品用途:

用作擴散阻擋層,阻止鋁或銅在硅中的擴散,同時對與其接觸的材料有粘附作用。

Application:

It is used as a diffusion barrier to prevent the diffusion of Al or Cu in Si, and has adhesion to the materials in contact with it.


產(chǎn)品性能參數(shù)/Product Property Parameters:

化學成分

Chemical Compositions

主含量,(%

Main Content, %

W

89.45~90.45

Ti

10±0.5

 

 

 

 

 

 

雜質(zhì)含量

(質(zhì)量分數(shù)),

%,不大于)

Impurity Content (mass fraction), %, max

Fe

0.0030

Al

0.0020

Si

0.0010

Mg

0.0010

Ni

0.0010

Ca

0.0020

Cu

0.0010

Pb

0.0010

Bi

0.0010

Sn

0.0010

Sb

0.0010

As

0.0010

Mo

0.0060

P

0.0020

C

0.0020

N

0.0020

O

0.0020

注:鉬含量為100%減去表中所列雜質(zhì)元素實測含量的總和(不包含氣體元素);需方如有特殊要求時,由供需雙方協(xié)商確定,并在合同或訂貨單中注明。

Note: Molybdenum content is the sum of 100% minus the measured content of impurity elements listed in the table (excluding gas elements). Special requirements will be agreed upon by the supplier and buyer, and indicated in the contract or purchase order.

 

其他性能Others:

相對密度

Relative Density

平均晶粒尺寸

Average Grain Size

(μm)

粗糙度

Roughness

(Ra, μm)

平面度

Flatness

mm

98%

100

0.8

1%

 

尺寸Size:

形狀

Shape

厚度

Thicknessmm

寬度

Widthmm

長度

Lengthmm

直徑

Diametermm

圓形Round

3-25

-

-

450

 

 

注:如有特殊要求,雙方具體商定。

Note: Special requirements will be agreed upon by the supplier and buyer.


Telephone

0731-88056699

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